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the agilent technologies' W2635A and w2636a ddr3 bga probe adapters provide signal access to the clock, strobe, data, address and command signals of the ddr3 bga package for making electrical and timing measurements with an infiniium oscilloscope. the ddr3 jedec 1 specification (jesd79-3c) is defined at the dram ballout, and the ballout is difficult to access. the bga probe adapter provides direct signal access to the bga package for true compliance testing. the W2635A and w2636a ddr3 bga probe adapters are soldered in between the dram and pc board or dimm raw card where the dram would normally be soldered. they are designed with the pcb or dimm footprint on the bottom side and the dram footprint on the top side. the bga adapter passes the signals from the memory controller chip and dram directly to the top side of the bga probe adapter where they can be accessed with oscilloscope probes. buried resistors placed at the signals inside the bga probe adapter connect the probed signals to solder pads designed to work with agilent infiniimax e2677a, n5381a, n5425a, and n5426a differential solder-in probe heads. these resistors isolate the ddr3 signal and the probe loading effect. this design minimizes capacitive loading of the probe heads and allows high-speed operation without impact on signal integrity. probing at the right location is also an important consideration for ddr3 measurement. many designs have vias or designed-in probe points, but they do not always produce good signal integrity. probing at the wrong W2635A and w2636a ddr3 bga probe adapter for infiniium oscilloscopes data sheet superior probing for ddr3 compliance test and debug location could cause signal reflection, resulting in non-monotonic edges. this will cause error in your tests such as slew rate, setup and hold time measurements. when used with agilent's u7231a ddr3 compliance test application, the bga adapter provides a fast and easy way to test, debug and characterize your ddr3 designs. the tests covered by the u7231a software are based on the jedec (jesd79-3c) ddr3 sdram specification. the test application offers a user-friendly setup wizard and a comprehensive report that includes margin analysis. 1 the jedec (joint electronic device engineering council) solid state technology association is a semiconductor engineering standardization body of the electronic industries alliance (eia), a trade association that represents all areas of the electronic industry.
2 features ? provides signal access points for ddr3 dram x4, x8 and x16 packages using jedec-standard common bga footprints to the oscilloscope ? 10-mm and 11-mm bga probe adapter widths for different spacing requirement between the dram placements on the pcb or dimm ? buried resistors provide signal isolation and minimize capacitive loading ? probing compatibility with infiniimax probe, which includes e2677a, n5381a, and n5425a/ n5426a differential solder-in probe heads installing the ddr3 bga probe adapter the W2635A and w2636a ddr3 bga probe adapter is installed by soldering it to the bga footprint on the pc board or dimm card where the dram normally would be soldered. then you can solder the ddr3 dram to the top side of the bga probe adapter. these attachment steps may occur in any order. the probe is designed to tolerate lead-free soldering temperature profiles. however, we recommend you apply the minimum temperature required for soldering and you use the minimum number of heating and cooling cycles to reduce risk of any damage to the probe. the probe is supplied without solder balls attached. depending on the exact attachment order, you may prefer to use either leaded or lead-free solder to attach the bga probe adapter. we recommend you attach the bga probe during the manufacturing process. for designs that are manufactured, it will require expertise to attach the bga probe adapter. if you lack the in-house expertise to attach the bga probe adapter, you may wish to work with a contract manufacturer with this expertise that may be willing to perform the attachment for a fee. you can find more information on bga soldering and rework techniques that may be useful in attaching the probe at: http://www.circuitrework.com/ guides/9-0.shtm http://www.agilent.com/find/ ddr3bga-scope figure 1. the diagram above shows the top (left) and bottom (right) view of the w2636a ddr3 bga probe adapter. the top side shows the footprint for ddr3 dram and the bottom side shows the footprint for a pc board or dimm card. superior probing for ddr3 compliance test and debug
3 installing the infiniimax probe you can use the ddr3 bga probe adapter with various infiniimax solder-in probes. instructions that come with the infiniimax probe provide details on the proper soldering procedures for the infiniimax probe heads. figure 2. the picture above shows the infiniimax n5425a and n5426a zif probe head connected to the w2636a ddr3 bga probe adapter. superior probing for ddr3 compliance test and debug
4 ddr3 bga probe adapters dimensions, pad numbering and location W2635A-010 dimensions, pad numbering and location size height = 13.97 mm (0.550 in) width = 11.176 mm (0.440 in) thickness = 1.575 mm (0.062 in) brings 20 signals to smt pads for probing provides 12 gnd pads (6 on either side of ddr3 bga probe adapter) 75-ohm buried tip resistor table 1. W2635A-010 pad numbering pin # signal 1 gnd 2 ldqs 3 ldqs# 4 gnd 5 ras 6 cas 7 gnd 8 odt 9 cs0 10 gnd 11 cs1 12 we 13 gnd 14 ba0 15 ba2 16 gnd signal pin # gnd 17 dq1 18 dq3 19 gnd 20 dq7 21 dq5 22 gnd 23 ck 24 ck# 25 gnd 26 cke 27 a10 28 gnd 29 ba1 30 a12 31 gnd 32
5 W2635A-011 dimensions, pad numbering and location size height = 13.97 mm (0.550 in) width = 12.192 mm (0.480 in) thickness = 1.575 mm (0.062 in) brings 20 signals to smt pads for probing provides 12 gnd pads (6 on either side of ddr3 bga probe adapter) 75-ohm buried tip resistor ddr3 bga probe adapters dimensions, pad numbering and location table 2. W2635A-011 pad numbering pin # signal 1 gnd 2 ldqs 3 ldqs# 4 gnd 5 ras 6 cas 7 gnd 8 odt 9 cs0 10 gnd 11 cs1 12 we 13 gnd 14 ba0 15 ba2 16 gnd signal pin # gnd 17 dq1 18 dq3 19 gnd 20 dq7 21 dq5 22 gnd 23 ck 24 ck# 25 gnd 26 cke 27 a10 28 gnd 29 ba1 30 a12 31 gnd 32
6 w2636a-010 dimensions, pad numbering and location size height = 19.05 mm (0.750 in) width = 11.176 mm (0.440 in) thickness = 1.575 mm (0.062 in) brings 26 signals to smt pads for probing provides 14 gnd pads (7 on either side of ddr3 bga probe adapter) 75-ohm buried tip resistor ddr3 bga probe adapters dimensions, pad numbering and location table 3. w2636a-010 pad numbering pin # signal 1 gnd 2 dq13 3 dq19 4 gnd 5 dq0 6 ldqs 7 gnd 8 ldqs# 9 ras 10 gnd 11 cas 12 odt 13 gnd 14 cs0 15 cs1 16 gnd 17 we 18 ba0 19 gnd 20 ba2 signal pin # gnd 21 dq12 22 dq14 23 gnd 24 udqs# 25 udqs 26 gnd 27 dq3 28 dq5 29 gnd 30 ck 31 ck# 32 gnd 33 cke 34 a10 35 gnd 36 ba1 37 a12 38 gnd 39 a11 40
7 w2636a-011 dimensions, pad numbering and location size height = 19.05 mm (0.750 in) width = 12.192 mm (0.480 in) thickness = 1.575 mm (0.062 in) brings 26 signals to smt pads for probing provides 14 gnd pads (7 on either side of ddr3 bga probe adapter) 75-ohm buried tip resistor signal pin # gnd 21 dq12 22 dq14 23 gnd 24 udqs# 25 udqs 26 gnd 27 dq3 28 dq5 29 gnd 30 ck 31 ck# 32 gnd 33 cke 34 a10 35 gnd 36 ba1 37 a12 38 gnd 39 a11 40 ddr3 bga probe adapters dimensions, pad numbering and location table 4. w2636a-011 pad numbering pin # signal 1 gnd 2 dq13 3 dq9 4 gnd 5 dq0 6 ldqs 7 gnd 8 ldqs# 9 ras 10 gnd 11 cas 12 odt 13 gnd 14 cs0 15 cs1 16 gnd 17 we 18 ba0 19 gnd 20 ba2
8 ordering information ddr3 bga probe adapter model numbers and options. each model comes with a kit of 10 bga probe adapters. model number description W2635A-010 x8, 10 mm width ddr3 bga probe adapter for x4 and x8 dram package W2635A-011 x8, 11 mm width ddr3 bga probe adapter for x4 and x8 dram package w2636a-010 x16, 10 mm width ddr3 bga probe adapter for x16 dram package w2636a-011 x16, 11 mm width ddr3 bga probe adapter for x16 dram package infiniium oscilloscope and infiniimax oscilloscope probe amplifiers and probe heads that are recommended for use with the ddr3 bga probe adapters product description 9000 series 9404a 4-ghz 4-channels 10 gsa/s infiniium scope 90000 series 90404a 4-ghz, 4 channels infiniium scope 90604a 6-ghz, 4 channels infiniium scope 90804a 8-ghz, 4 channels infiniium scope 91204a 12-ghz, 4 channels infiniium scope 91304a 13-ghz, 4 channels infiniium scope
9 ordering information probe accessories infiniimax probe amplifiers model number description 1169a 12-ghz differential probe amplifier 1168a 10-ghz differential probe amplifier 1134a 7-ghz differential probe amplifier 1132a 5-ghz differential probe amplifier 1131a 3.5-ghz differential probe amplifier infiniimax probe heads model number description n5381a infiniimax ii 12-ghz differential solder-in probe head and accessories n5382a infiniimax ii 12-ghz differential browser e2677a infiniimax 12-ghz differential solder-in probe head and accessories n5425a infiniimax 12-ghz zif probe head n5426a infiniimax zif tips (x10) (requires both n5425a and n5426a) n5451a infiniimax differential long wire zif tip (x10) (requires both n5425a and n5451a) related literature publication title publication type publication number infiniium 90000 series oscilloscopes and infiniimax series probes data sheet 5989-7819en agilent infiniiscan event identification software for infiniium 80000 and 8000 series oscilloscopes (n5414a and 5415a) data sheet 5989-4605en agilent technologies e2688a, n5384a high-speed serial data analysis and clock recovery software for infiniium series oscilloscopes data sheet 5989-0108en agilent technologies ezjit and ezjit plus jitter analysis software for infiniium series oscilloscopes data sheet 5989-0109en a time-saving method for analyzing signal integrity in ddr memory buses application note 5989-6664en to download copies of these publications go to www.agilent.com/find/ddr3bga-scope
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